TI CC2652P Platform — E72-2G4M20S1E & Link72: Flagship Solutions for ZigBee 3.0 Self-Organizing Networks
As ZigBee entered the 3.0 era, network scale and stability became the key measures of module capability. TI's CC2652P—a multi-function SoC with an integrated PA—provides strong support for large-scale self-organizing networks. EBYTE's E72-2G4M20S1E and Link72, built on this chip, are the representative products for ZigBee 3.0 mesh applications. The CC2652P is a multi-function wireless SoC from TI's SimpleLink™ series, carrying a 48 MHz ARM Cortex-M4F processor with a built-in power amplifier (PA). It supports ZigBee, Thread, BLE, and other protocols. Its processing power and integrated PA give it clear advantages in network scale and communication range. Link72's most striking feature is support for up to 200 devices in one network—a high level among ZigBee solutions, capable of large smart homes, building automation, and industrial transport scenarios. The unified ZigBee 3.0 protocol also makes cross-vendor interoperability smoother. Link72 and E72-2G4M20S1E fit whole-home smart networking, building automation (unified management of lighting, HVAC, security), and industrial transport (equipment coordination and condition monitoring). The 200-node capability gives them a clear edge in large-scale deployments. With its integrated PA and strong processing power, the CC2652P platform provides a flagship hardware foundation for ZigBee 3.0 mesh networking. The E72-2G4M20S1E and Link72—anchored by 200-node networking—are ideal choices for large-scale IoT self-organizing applications. Tell us what you need. We'll send you the best deal Shipping notice: For door-to-door / DDP service to the US, Canada, and Europe Shop on RobotShop How to Order: Submit Your Request Free Samples for University Students — University-Sponsorship ApplicationsIntroduction
The Chip Core: What Is the CC2652P?
Product Overview
Key Highlight: 200-Node Networking
Key Features
Applications
Conclusion
